The FICPI SEAD patent drafting course (pronounced ‘Seed’) is a well-established FICPI education initiative, designed to help early career IP professionals to improve their drafting skills and knowledge of the most commonly used IP systems.
The renowned course is comprised of 3 segments, two of which are in-person, this year taking place in Singapore.
Students attend from countries and regions including Hong Kong, Singapore, Australia, Malaysia, Brazil, Colombia, Europe, Thailand, India, Vietnam, Saudi Arabia, the Philippines, Taiwan.
We are offering the opportunity to support IP professionals early in their career, especially from developing nations, by sponsoring segment 3 of the 2024 course (taking place in September 2024), the whole of the 2025, 2026 and 2027 course editions, or individual editions/years.
Through the sponsorship you’ll gain recognition across FICPI’s communication platforms, LinkedIn, and the SEAD brochure. PLUS you’ll have the opportunity to attend the in-person training and deliver a talk to trainees, sponsor a dinner, or to send one or more of your own staff to the course at reduced cost or free.
Sponsorship options start from Euro 700 for Segment 3 of the 2024 course. Platinum Sponsorship of the entirety of the 2025, 2026 and 2027 courses (including a bonus of Segment 3 of the 2024 course) is our highest tier, at Euro 15,000.
Find out more about the sponsorship options available in the attachment.
| Attachment | Size |
|---|---|
| FICPI Sponsorship Proposal FICPI SEAD 2024 - V1-12Aug2024.pdf | 1.88 MB |